Internship: Novel Attachment Technologies in Power Semiconductor Modules (80
ABB
Lenzburg, Aargau, Switzerland
vor 14 Tg.
  • Setting up the DIE and terminal assembly processes (e.g. on pick-and-place device), perform experimental designs (e.g.
  • DoE) and statistical analysis of the processes

  • Characterization of attachment quality and performance by scanning acoustic microscopy
  • Sample preparation and characterization of cross sections by light microscopy and / or scanning electron microscopy
  • Analysis and interpretation of results and definition of process parameters and windows
  • Documentation of the results and presentation within the engineering team
  • Requirements :

  • Student in a technical field (minimum Bachelor of material science, chemistry, physics, micro engineering, engineering)
  • Interested in novel attachment technologies and processes
  • Interested in statistical methods and tools
  • High degree of self-motivation and fast learning, independent way of working and organizing
  • German is a must, English is beneficiary
  • Duration of internship : 4 - 6 months
  • Agency referrals will not be considered for this position.

    Candidates must be in possession of a valid work permit which would authorize them to work for ABB in Switzerland.

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