Geneva, Switzerland
vor 1 Tg.

Main tasks

  • Support the growth of LEM with innovative semiconductor-based products
  • Deliver to the traditional transducer business ASICs and Field Sensor
  • Develop the semiconductor team in skills, competencies and external network of suppliers
  • Interpreting the market requirements and developing a roadmap for ASIC dies, packaging, testing and Integrated Current Sensors (ICS) and Magnetic sensors.
  • Proposing solutions that meet both market and financial requirements for commercial viability.
  • Executing approved programs to bring them both online to SOP and on target to stated objectives.
  • Working closely with Innovation team to further define new fields of interest and potential technologies around microelectronics that can benefit LEM.
  • Developing and getting approval for both short term and midterm budgets.
  • Conducting what if scenarios for potential choices the company could take.
  • Establish BOM’s, processes and suppliers to execute selected product solutions.
  • Managing multiple projects with external suppliers and research organizations.
  • Conducting package reliability evaluations and failure analysis to ensure that product performance of LEM is consistently met.
  • Designing and administering qualification plans in support of new sensors & ICS transducers.
  • Support IE’s on production including yield improvement as required.
  • Managing a technological surveillance on new technologies that are susceptible to advance LEM’s product positioning.
  • Generate LEM’s corporate R&D packaging roadmap in conjunction with PM’s.
  • Conduct training of new sales staff relating to the products that are supported.
  • Skills

  • Master’s degree or PhD in Electronic Engineering
  • Minimum 10 years experience in Industrial Electronic design, ideally high volume environment
  • ASIC knowledge especially in Analog IC’s
  • Knowledge of ASIC design including tools, processes and methods.
  • Semi packaging knowledge in LF, QFN, F / C, eWLB and other technologies.
  • Testing knowledge with high parallelism in automotive environment.
  • OSAT process knowledge including FE, BE & test operations.
  • Broad ecosystem contacts in FAB, OSAT, and design subcontractors.
  • DOE, SixSigma, Design for Mfg, AECQ100, ASIL, FEA experience
  • Analog and Digital open loop transducer expertise or equivalent
  • General software : PPT, excel, word.
  • Can do attitude
  • Proactive self-starter
  • Able to interact with EXCO & board mgmt
  • Open to new challenges
  • Team player inside and outside
  • Able to develop new and innovative ideas
  • Startup mode in a medium size company environment
  • Bewerben
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